MPi Kestral Probe Cards
Canteliver Probe Card
MPI Cantilever Probe Card is greatly applied on gold bump and pad wafer screening for display driver, logic, and memory unit. MPI’s cantilever probes would be the corresponding response into the demands of fine pitch, little pad measurement, significant velocity, much less cleaning, multi-DUT, large pin rely, and ultra-lower leakage necessities. With outstanding craftsmanship, progressive architecture and established methodologies based upon mechanical and electrical simulation/measurement success, earning MPI the best cantilever service provider worldwide.
FCB Probe Card
The FCB Probe Card is the most experienced technological know-how of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and price of exam (COT) demand from customers. FCB is often a tested Option for a range of semiconductor generation exams from early engineering pilot-runs to superior quantity manufacturing (HVM). FCB is ready for machine necessitating large sign integrity probing (SI) and/or electric power integrity probing (PI). Programs consist of chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus much more. FCB ensures the world’s most effective Over-all Expense-of-possession (COO) for a variety of DUT applications.
EVS Probe Card
The EVS Probe Card can be an improvement over the standard buckling beam probe card. Crucial features are better present carrying capability (C.C.C.) and lessen balanced Call power (BCF), and All round MEMS-like characteristics. EVS can easily fulfill the necessity of Highly developed wafer probing. Precise alignment and great planarity control tend to be the key variables contributing to secure Make contact with resistance. With its ability and performance, EVS Probe Card is an excellent option for advanced probe cards.
Osprey probe card
The Osprey probe card is MPI’s Resolution to demand from customers for at any time finer pitch. It really is created for lesser Al pad, and is ideal for small pitch application with peripheral and whole array sample. With specific alignment and much better planarity Handle, Osprey can access bigger efficiency by multi-DUT design. The forming wire (FW) sort needle developed with MPI’s individual micro fabrication system not only delivers higher-high quality functionality and also lets uncomplicated needle substitution and shortens protecting cycle time.
Kestrel Probe Card
The Kestrel Probe Card is provided with MEMS wire (MW) needle which happens to be suitable for the demand from customers of very low pressure probing. What's more, it includes the opportunity to satisfy large C.C.C. and large pin counts application. The MEMS procedure ensures highly dependable needle properties, as well as Exclusive framework design and style enables specific alignment and planarity Management.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today check here and for many generations to come.
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